Week4
Week 4 Progress: Soldering and Initial Hardware Integration
Objective:
To assemble the hardware system by soldering key electronic components onto a compact custom circuit layout, with the goal of achieving a fully wearable and functional ankle monitoring device.
Implementation:
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Design Decision:
To ensure better comfort and wearability, I chose not to use pin headers, opting instead for direct soldering of all components. -
Component Integration:
Based on the approved component list, I soldered the following key modules:-
Seeed Studio nRF52840 microcontroller (main controller)
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Flex sensors (x2)
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Resistors for voltage divider
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Op-amp module (impedance buffer)
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3.7V Lithium battery connector
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Type-C charging module
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Wires and connectors for external integration
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Challenges Faced:
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Solder pads were very small, especially on the nRF52840 board, making precision soldering difficult.
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In multiple cases, solder failed to adhere properly to the pad or formed weak joints.
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During initial circuit testing, no voltage readings or signals were observed, suggesting connection issues.
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Troubleshooting Steps:
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Used a fine-tip soldering iron and flux pen to improve joint formation.
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Applied low-temperature solder wire to reduce the risk of lifting pads or damaging the board.
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Tested continuity using a multimeter for every connection, and reflowed any cold joints.
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Resoldered the microcontroller power and signal lines, which resolved the no-data issue.
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Verified flex sensor voltage divider output via oscilloscope, confirming live analog signal.
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Results:
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All components were successfully soldered and securely fixed onto the board.
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Connectivity of all analog and power lines was confirmed via multimeter and voltage tests.
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The board is now physically complete and functionally ready for code upload and system testing.
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This hardware revision lays the foundation for future integration with the plastic wearable base and BLE communication.


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